Ask what Korea is talking about.

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's advanced semiconductor packaging technology laboratory in Yokohama, Japan, on Nov. 1, about two months after it began operations in September, to review development of next-generation packaging materials and processes and discuss expanding ties with Japanese materials, parts, and equipment firms. Yonhap reports the visit, and Korean outlets like Dong-A Ilbo, Chosun Ilbo, and Maeil Business News highlight his emphasis on securing advanced packaging technology as key to AI-era semiconductor competitiveness. The visit follows his Oct. 27 trip to a robotics R&D site on his fourth anniversary in office, per Korea Times and Business Korea.