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Samsung chief Lee Jae-yong visits Japan packaging lab

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's semiconductor advanced packaging technology laboratory in Japan on Sunday, pledging to continue expanding its research workforce there and develop the technology, according to Korea Times and Yonhap reports. The visit, which took place on Nov. 1, follows his Oct. 27 trip to a robotics R&D site marking his fourth anniversary in office, as Business Korea reported. Korean media coverage focuses on the strategic importance of advanced packaging for Samsung's chip business, with the Korea Times noting Lee's four-year bet on chips has paid off as Samsung's profit surges.

  1. Samsung chairman highlights chip packaging, visits Japanese unit Korea Times · 2026-11-01
  2. Samsung chief visits Advanced Package Lab in Japan Yonhap · 2026-11-01
  3. Lee Jae-Yong Visits Samsung Robotics Forward Base Business Korea · 2026-10-27
  4. Lee Jae-yong's 4-year bet on chips pays off as Samsung profit surges Korea Times · 2026-10-27

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