Ask what Korea is talking about.

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's advanced semiconductor packaging research hub (APL) in Yokohama, Japan, on Nov. 1, just two months after it opened, to review next-generation packaging technology and discuss cooperation with Japanese materials, parts, and equipment firms. Yonhap reports the visit was aimed at securing advanced packaging technology, seen as key to AI chip competitiveness. Korean media, including Kyunghyang and Maeil Business, framed the trip as hands-on management to lead the AI semiconductor race, with Lee checking technology development and collaboration plans with Japan's supply chain.