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Samsung Electronics Executive Chairman Lee Jae-yong visited the company's advanced semiconductor packaging laboratory (APL) in Yokohama, Japan, on Nov. 1, just two months after it opened, to review packaging technology and explore cooperation with Japanese materials, parts, and equipment firms. Yonhap and the Korea Times report the visit underscores packaging as a key battleground in AI chip competition. Lee pledged to continue expanding the research workforce there, according to the Korea Times.