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Samsung chief visits Japan packaging lab

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's semiconductor advanced packaging technology laboratory in Japan on Sunday, pledging to continue expanding its research workforce there and develop the technology, according to Korea Times and Yonhap. The visit was not tied to a founding anniversary in the supplied documents; it was reported as a routine inspection of the advanced packaging lab. Korean outlets did not mention a founding anniversary connection, and no blog or café reactions were provided.

  1. Samsung chairman highlights chip packaging, visits Japanese unit Korea Times · 2026-11-01
  2. Samsung chief visits Advanced Package Lab in Japan Yonhap · 2026-11-01

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