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Samsung Chairman Inspects Chip Packaging in Japan

Samsung Electronics Chairman Lee Jae-yong visited the company's advanced packaging technology laboratory in Yokohama, Japan, on Nov. 1 to review the status of development and discuss cooperation with local suppliers and equipment firms, industry sources said. The visit comes as Samsung seeks to secure advanced packaging technology, a key battleground for AI chip competition.

  1. Samsung chairman highlights chip packaging, visits Japanese unit Korea Times · 2026-11-01
  2. Samsung chief visits Advanced Package Lab in Japan Yonhap · 2026-11-01
  3. 이재용, 일본서 첨단 패키징 점검…소부장 협력 모색 연합뉴스 · 2026-11-01
  4. 이재용, 일본 요코하마 패키징랩 첫 점검…‘AI 반도체 승부처’ 챙긴다 경향신문 · 2026-11-01
  5. 이재용 회장, 日 삼성 반도체 패키징 연구거점 찾아 미래 기술 점검 조선일보 · 2026-11-01

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