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Samsung chairman visits Japan chip packaging lab

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's advanced semiconductor packaging technology laboratory in Yokohama, Japan, on Nov. 1, just two months after it opened, to review technology development and discuss cooperation with Japanese materials, parts, and equipment firms, according to Yonhap and other Korean outlets. The visit, which coincided with Samsung's 57th founding anniversary, was seen as a focus on AI semiconductor competitiveness, with Lee pledging to expand the research workforce there, as reported by the Korea Times and Kyunghyang Shinmun.

  1. Samsung chairman highlights chip packaging, visits Japanese unit Korea Times · 2026-11-01
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  3. Samsung chief visits Advanced Package Lab in Japan Yonhap · 2026-11-01
  4. 이재용 회장, 日 삼성 반도체 패키징 연구거점 찾아 미래 기술 점검 조선일보 · 2026-11-01
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