Ask what Korea is talking about.

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's advanced semiconductor packaging research hub (APL) in Yokohama, Japan, on Nov. 1, two months after it opened, to review technology development and discuss cooperation with Japanese materials, parts, and equipment firms, Yonhap and other outlets report. The visit underscores packaging as a key battleground in AI chip competition, with Lee emphasizing securing advanced packaging technology for AI semiconductors. This follows his Oct. 27 visit to a robotics R&D site on his 4th anniversary in office, and an Oct. 22 trip to a UAE gas plant construction site, as part of broader efforts to bolster future growth engines.