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Samsung chairman checks Japan packaging lab for AI chips
Samsung Electronics Executive Chairman Lee Jae-yong visited the company's advanced semiconductor packaging research hub (APL) in Yokohama, Japan, on Nov. 1, just two months after it opened, to review technology development and discuss cooperation with Japanese materials, parts, and equipment firms, Yonhap and other Korean outlets report. The visit came on Samsung's 57th founding anniversary, with Lee skipping a separate ceremony to focus on what is seen as a key battleground for AI semiconductors. He pledged to continue expanding the research workforce there, according to the Korea Times. Korean media frame the trip as hands-on management to secure advanced packaging competitiveness, with Kyunghyang noting Lee checked the lab's status alongside local research chiefs.


















