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Samsung Electronics Executive Chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on Nov. 1, about two months after it began operations in September, to review next-generation packaging technology development and discuss expanding cooperation with Japanese materials, parts, and equipment firms, according to Yonhap and other Korean outlets. The visit underscores Samsung's focus on advanced packaging as a key battleground in AI semiconductor competition, with Lee also pledging to grow the research workforce there, as reported by the Korea Times and Dong-A Ilbo. Korean media framed the trip as part of Lee's broader push to secure a technological edge, following earlier visits to a robotics R&D center on Oct. 27 and a UAE gas plant site on Oct. 22, per Business Korea and Korea Times reports.