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Samsung Electronics Executive Chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on Nov. 1, about two months after it began operations in September, to review next-generation packaging materials and process technology and discuss expanding ties with Japanese materials, parts, and equipment firms, Yonhap and other Korean outlets report. The visit underscores advanced packaging as a key battleground in AI semiconductor competition, with Lee pledging to continue expanding the research workforce there, according to Korea Times and Dong-A Ilbo. Korean media frame this as part of Lee's broader push to secure chip competitiveness, following his Oct. 27 visit to a robotics R&D center on his fourth anniversary in office and an Oct. 22 trip to a UAE power plant site, as reported by Business Korea and Korea Times.