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Samsung Electronics Chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on Nov. 1, about two months after it began operations in September, to review next-generation packaging technology development and discuss cooperation with Japanese materials, parts, and equipment firms. Yonhap reports the visit was part of efforts to secure advanced packaging, a key to AI semiconductor competitiveness, and it came on Samsung's 57th anniversary, with no separate ceremony held.